The First China-made Conference System Chipset Displayed at the 10th China HI-TECH Fair

Время публикации: 2008-10-20

The First China-made Conference System Chipset Displayed at the 10th China HI-TECH Fair

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Время публикации: 2008-10-20 00:00
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Подробности

The First China-made Conference System Chipset Displayed at the 10^th China HI-TECH Fair

Oct.20 2008

Shenzhen TAIDEN Company exhibited at the 10th China HI-TECH Fair, a leading high-tech exhibition in China, held from October 10th to 17th 2008 in Shenzhen Convention & Exhibition Centre. The first Digital Infra-red Wireless Conference System in the world, together with TAIDEN independently developed Conference system chipset, was on show in TAIDEN exhibition booth located in the Olympic High-tech Zone. With operation of TAIDEN Fully Digital Conference System and Digital Infra-red Language Distribution System, the news release conference of 29th Beijing Olympic Games reappeared, an attraction for visitors.　

TAIDEN Booth

TAIDEN conference system and simultaneous interpretation system were in use during the 29th Beijing Olympics. TAIDEN brought its “Conference Chipset” – the first china-made conference system chipset – to the 10th HI-TECH Fair. Demo Olympic on-site press conferences were held several times per day in TAIDEN Booth, reproducing the performance of TAIDEN’s equipment during the news release conferences at the Beijing Olympics. All the visitors had a wonderful experience with high-end technologies such as simultaneous interpretation system. TAIDEN conference system chipset as well as the first digital infra-red wireless conference system in the world attracted great attention from visitors, government and media.